ordering information to obtain optocouplers with gull wing leads, order the standard part number and option 300. example: hcpl-2630#300 for option 300, 4-pin 300 mil package is shipped in tubes with 100 units per tube. 6-pin 300 mil package is shipped in tubes with 65 units per tube. for solid state relay (photo mosfet) parts, their 6-pin 300 mil or 8-pin 300 mil pack- ages are shipped in tubes with 50 units per tube. 8-pin 300 mil package is shipped in tubes with 50 units per tube. 8-pin 400 mil package is shipped in tubes with 42 units. to obtain optocouplers with gull wing leads shipped in tape and reel, order option 500 instead of option 300. description option 300 is available on most optocouplers. it consists of standard dual-in-line package devices with gull wing leads. the lead profile is designed to be compatible with standard surface mount processes. option 300 enables electronic component assemblers to include avago technologies optocouplers on a pcb that utilizes surface mount processes. these options do not require through hole in a pcb. this reduces board costs, while potentially increasing assembly rates and component density per board. for the maximum solder reflow thermal profile, please refer to figures 8 and 9. figure 1. 4-pin 300 mil package. 6.5 0.5 (0.256) dimensions in millimeters and (inches) 2.54 9 1.5 1.3 pad location (for reference) 4.6 0.5 (0.181) 2.54 0.25 (0.1) 3.5 0.5 (0.138) 1.2 0.1 (0.047) 0.35 0.25 (0.014) 7.62 0.3 (0.3) 0.26 (0.010) 10.16 0.3 (0.4) 1.0 0.25 (0.039) option 300 gull wing surface mount option for optocouplers data sheet
2 figure 2. 6-pin 300 mil package. figure 3. 8-pin 300 mil package. 6.5 0.5 (0.256) dimensions in millimeters and (inches) 7.3 0.5 (0.287) 2.54 0.25 (0.1) 3.5 0.5 (0.138) 7.62 0.3 (0.3) 0.35 + 0.15/-0.10 (0.014) 10.16 0.3 (0.4) 1.2 0.1 (0.047) 0.35 0.25 (0.014) 1.0 0.25 (0.039) 2.54 9 1.5 1.3 pad location (for reference) 2.54 0.635 0.25 (0.025 0.010) 12 nom. 9.65 0.25 (0.380 0.010) 0.635 0.130 (0.025 0.005) 7.62 0.25 (0.300 0.010) 5 6 7 8 4 3 2 1 9.65 0.25 (0.380 0.010) 6.350 0.25 (0.250 0.010) 1.016 (0.040) 1.27 (0.050) 10.9 (0.430) 2.0 (0.080) land pattern recommendation 1.080 0.320 (0.043 0.013) 3.56 0.13 (0.140 0.005) 1.780 (0.070) max. 1.19 (0.047) max. 2.54 (0.100) bsc dimensions in millimeters (inches). lead coplanarity = 0.10 mm (0.004 inches). note: floating lead protrusion is 0.15 mm (6 mils) max. 0.20 (0.008) 0.33 (0.013)
3 figure 5. 8-pin 400 mil package. 1.00 0.15 (0.039 0.006) 7 nom. 12.30 0.30 (0.484 0.012) 0.75 0.25 (0.030 0.010) 11.00 (0.433) 5 6 7 8 4 3 2 1 11.15 0.15 (0.442 0.006) 9.00 0.15 (0.354 0.006) 1.3 (0.051) 13.56 (0.534) 2.29 (0.09) land pattern recommendation 1.78 0.15 (0.070 0.006) 4.00 (0.158) max. 1.55 (0.061) max. 2.54 (0.100) bsc dimensions in millimeters (inches). lead coplanarity = 0.10 mm (0.004 inches). note: floating lead protrusion is 0.15 mm (6 mils) max. 0.254 + 0.076 - 0.0051 (0.010 + 0.003) - 0.002) max. figure 4. 8-pin 300 mil package (digital isolator) 0.030 (0.762) 0.045 (1.143) 0.370 (9.400) 0.390 (9.900) 0.240 (6.100) 0.260 (6.600) 87 6 5 4 3 2 1 0.045 (1.143) 0.065 (1.651) 0.120 (3.048) 0.150 (3.810) 0.047 (1.194) 0.070 (1.778) 0.040 (1.016) 0.047 (1.194) 0.370 (9.398) 0.390 (9.906) 0.190 (4.826) 0.015 (0.381) 0.025 (0.635) 0.025 (0.632) 0.035 (0.892) 0.030 (0.760) 0.056 (1.400) 0.015 (0.385) 0.035 (0.885) 0.290 (7.370) 0.310 (7.870) 0.370 (9.400) 0.390 (9.900) pad location (for reference only) typ. 12 nom. 0.008 (0.203) 0.013 (0.330) 0.100 (2.540) bsc dimensions inches (millimeters) lead coplanarity = 0.004 inches (0.10 mm) min max
4 figure 6. 6-pin 300 mil package (solid state relay (photo mosfet)) figure 7. 8-pin 300 mil package (solid state relay (photo mosfet)) 4.19 (0.165) 2.29 (0.090) 2.54 (0.100) typ. 0.635 0.130 (0.025 0.005) 9.65 0.25 (0.380 0.010) 7.62 0.25 (0.300 0.010) 0.635 0.25 (0.025 0.010) 12 nom. 0.20 (0.008) 0.30 (0.013) 1.78 (0.070) max. 9.65 0.25 (0.380 0.010) 6.35 0.25 (0.250 0.010) 1.27 (0.050) 10.9 (0.430) max. 2.0 (0.080) note: floating lead protrusion is 0.25 mm (10 mils) max. land pattern recommendation 0.635 0.25 (0.025 0.010) 12 nom. 9.65 0.25 (0.380 0.010) 0.635 0.130 (0.025 0.005) 7.62 0.25 (0.300 0.010) 5 6 7 8 4 3 2 1 9.65 0.25 (0.380 0.010) 6.350 0.25 (0.250 0.010) 1.016 (0.040) 1.27 (0.050) 10.9 (0.430) 2.0 (0.080) land pattern recommendation 1.080 0.320 (0.043 0.013) 3.56 0.13 (0.140 0.005) 1.780 (0.070) max. 1.19 (0.047) max. 2.54 (0.100) bsc dimensions in millimeters (inches). lead coplanarity = 0.10 mm (0.004 inches). note: floating lead protrusion is 0.25 mm (10 mils) max. 0.254 + 0.076 - 0.051 (0.010 + 0.003) - 0.002)
5 solder reflow temperature profile 1) one-time soldering reflow is recommended within the condition of temperature and time profile shown at right. 2) when using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold of the device. keep the temperature on the package of the device within the condition of (1) above. 2 minutes 25 c 200 c 230 c 180 c 1.5 minutes 1 minute 30 seconds 1 minute figure 8. maximum solder reflow thermal profile for 4-pin 300 mil and 6-pin 300 mil packages. figure 9. maximum solder reflow thermal profile for 8-pin 300 mil and 8-pin 400 mil packages. 0 time (seconds) temperature ( c) 200 100 50 150 100 200 250 300 0 30 sec. 50 sec. 30 sec. 160 c 140 c 150 c peak temp. 245 c peak temp. 240 c peak temp. 230 c soldering time 200 c preheating time 150 c, 90 + 30 sec. 2.5 c 0.5 c/sec. 3 c + 1 c/C0.5 c tight typical loose room temperature preheating rate 3 c + 1 c/C0.5 c/sec. reflow heating rate 2.5 c 0.5 c/sec.
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2010 avago technologies. all rights reserved. obsoletes 5989-0297en av02-0640en - june 1, 2010 recommended pb-free ir profile figure 10. recommended pb-free ir profile 2 1 7 c r a mp - do wn 6 c/ se c . m ax . r a mp -u p 3 c/ se c . m ax . 1 50 - 200 c * 260 + 0 /- 5 c t 25 c t o pe ak 60 t o 1 50 se c . 1 5 se c . ti me within 5 c of actual pe ak t emper atu re t p t s pre h e at 60 t o 1 80 se c . t l t l t smax t smin 25 t p ti me t emper atu re n o t es : th e ti me f rom 25 c t o pe ak t emper atu re = 8 m inut es m ax . t smax = 200 c, t smin = 1 50 c n o t e : n o n-hali de flux s h o ul d b e u sed. * re c omme n ded pe ak t emper atu re f or wi de b od y 400mi l s p ackag e i s 245 c
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